Embedian, Inc.
16
SMARC-iMX8MM Computer on Module User’s Manual
v. 1.2
1.5
Document
and
Standard
References
1.5.1.
External
Industry
Standard
Documents
eMMC
(Embedded
Multi
‐
Media
Card)
the
eMMC
electrical
standard
is
defined
by
JEDEC
JESD84
‐
B45
and
the
mechanical
standard
by
JESD84
‐
C44
(
www.jedec.org
)
.
The
I2C
Specification,
Version
2.1,
January
2000,
Philips
Semiconductor
(now
NXP)
(
www.nxp.com
)
.
I2S
Bus
Specification,
Feb.
1986
and
Revised
June
5,
1996,
Philips
Semiconductor
(now
NXP)
(
www.nxp.com
).
JTAG
(Joint
Test
Action
Group
defined
by
IEEE
1149.1
‐
2001
‐
IEEE
Standard
Test
Access
Port
and
Boundary
Scan
Architecture
(
www.ieee.org
).
MXM3
Graphics
Module
Mobile
PCI
Express
Module
Electromechanical
Specification,
Version
3.0,
Revision
1.1,
©
2009
NVIDIA
Corporation
(
www.mxm
‐
sig.org
).
PICMG®
EEEP
Embedded
EEPROM
Specification,
Rev.
1.0,
August
2010
(
www.picmg.org
).
SD
Specifications
Part
1
Physical
Layer
Simplified
Specification,
Version
3.01,
May
18,
2010,
©
2010
SD
Group
and
SD
Card
Association
(Secure
Digital)
(
www.sdcard.org
).
SPI
Bus
–
“Serial
Peripheral
Interface”
‐
de
‐
facto
serial
interface
standard
defined
by
Motorola.
A
good
description
may
be
found
on
Wikipedia
(http://en.wikipedia.org/wiki/Serial_Peripheral_Interface_Bus).
USB
Specifications
(
www.usb.org
).
PCI
Express
Specifications
(
www.pci
‐
sig.org
)
SPDIF
(aka
S/PDIF)
(“Sony
Philips
Digital
Interface)
‐
IEC
60958
‐
3
eSPI
(“Enhanced
Serial
Peripheral
Interface”)
T
he
eSPI
Interface
Base
Specification
is
defined
by
Intel
https://downloadcenter.intel.com/de/download/22112
)
GBE
MDI
(“Gigabit
Ethernet
Medium
Dependent
Interface”)
defined
by
IEEE
802.3.
The
1000Base
‐
T
operation
over
copper
twisted
pair
cabling
defined
by
IEEE
802.3ab
(
www.ieee.org
).
RS
‐
232
(EIA
“Recommended
Standard
232”)
this
standard
for
asynchronous
serial
port
data
exchange
dates
from
1962.
The
original
standard
is
hard
to
find.
Many
good
descriptions
of
the
standard
can
be