Soldering
6 Soldering
Temperature profile for reflow soldering
:
Pb-Free Soldering Paste
: it is suggested to used soldering pastes that don't need later
clean for residuals.
Cleaning
: it's not suggested to clean the module. Solder paste residuals underneath the
module cannot be removed.
•
Water cleaning: the cleaning process using water can involve water entering
underneath the module between the two PCBs creating short circuits.
•
Alcohol cleaning: the cleaning process with alcohol can damage the module.
•
Ultrasound cleaning: the cleaning process with ultrasound can damage the module.
It is suggested to use no clean solder paste to avoid any need for cleaning.
Cycles:
it is suggested to do only one soldering cycle.
In case of reflow soldering, a drying bake should be done in order to prevent a popcorn
effect. Re-baking should be done following IPC standards. Any unused modules that has
been open for more than 168 hours or not stored at <10% RH should be baked before any
subsequent reflow.
EMB-Z2538PA Datasheet (rev 1.4)
Page 19 of 24
