Hardware Reference Manual
Overview
GFK-3022E
September 2021
Overview
1
Section 1:
Overview
A Computer-On-Module (COM) is a module containing all components necessary for a bootable
host computer, packaged as a super component. A COM requires a carrier board to connect I/O
and power up. COMs are used to build modular solutions and offer Original Equipment
Manufacturer (OEMs) fast time-to-market with reduced development cost. Like integrated
circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements.
For these reasons, the COM methodology has gained much popularity with OEMs in the
embedded industry.
The RXi2-XP IPC industrial computing platform delivers compact, rugged, mid to high
performance computing and high performance graphics capabilities to run HMI, historian, and
analytics applications for real-time control of operations. It offers the expandability of 0, 1, 2, or
4 (mini and low profile) PCI Express (PCIe) slots and CFast storage.
The RXi2-XP IPC (NextGenIPC) is composed of the following components:
•
bCOM6L18 COM Express module based on Intel
®
Skylake 6
th
Generation Core
™
i3/5/7
and Xeon
®
V5 series
•
CEC09 COM Express carrier board
•
PERC12 (1-slot), PERC10 (2-slot) and PERC11 (4-slot) PCIe riser board
•
PIP24VDC power supply module
•
SRC SATA riser board for additional 2.5 inch mass storage devices support
•
Industrial grade enclosure with heat sink for the module and carrier components
T
his chapter describes features, capabilities, and compatibilities of the RXi2-XP IPC and its
components
Figure 1-1
0-slot RXi2-XP IPC