15. PRECAUTIONS
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EPSON
S1D15722D01B000 Technical Manual (Rev.1.1)
15. PRECAUTIONS
When using this development specification, the following points should be noted.
1. This development specification is subject to change without notice for improvement.
2. This development specification does not permit and guarantee the implementation and/or use of the patent
properties and other intellectual property rights the third party or SEIKO EPSON owns.
The applications provided in this development specification are for understanding of our products, and we
are not responsible for any circuit problems that may occur when using them.
“Large” or “Small” in the characteristics table in this development specification refers to the relationship
on a numbered line.
3. No part of this material may be reproduced or duplicated in any form or by any means without the written
permission of Seiko Epson.
When using semiconductor chips, the following points should be noted.
[Precautions in Handling the IC against the Light]
If semiconductor chips are exposed to the strong light, their characteristics may change. Therefore, the IC
may malfunction if exposed to the light. To protect the ICs, the following general requirements must be
satisfied for IC mount boards and products.
(1) Do not expose the ICs to the light before they are mounted in the board design and IC mounting phases.
(2) Also, do not expose the ICs to the light in the inspection phase.
(3) Take all surfaces, top, bottom and sides, of the IC chip into consideration when blocking out light.
