HCPL-3700 A
C/DC to Logic Interface Optocoupler
©2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
HCPL-3700 Rev. 1.0.1
8
Package Dimensions
Through Hole
Surface Mount
Note:
All dimensions are in inches (millimeters)
0.4" Lead Spacing
Recommended Pad Layout for Surface Mount
Leadforms
0.200 (5.08)
0.140 (3.55)
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0.020 (0.51) MIN
0.390 (9.91)
0.370 (9.40)
0.270 (6.86)
0.250 (6.35)
3
0.070 (1.78)
0.045 (1.14)
2
4
1
5
6
7
8
0.300 (7.62)
TYP
0.154 (3.90)
0.120 (3.05)
0.016 (0.40)
0.008 (0.20)
15° MAX
PIN 1
ID.
SEATING PLANE
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.250 (6.35)
0.390 (9.91)
0.370 (9.40)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.405 (10.30)
MIN
0.315 (8.00)
MIN
0.045 [1.14]
3
2
1
4
5
6
7
8
0.016 (0.41)
0.008 (0.20)
PIN 1
ID.
0.200 (5.08)
0.140 (3.55)
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0.004 (0.10) MIN
0.390 (9.91)
0.370 (9.40)
0.270 (6.86)
0.250 (6.35)
3
0.070 (1.78)
0.045 (1.14)
2
4
1
5
6
7
8
0.400 (10.16)
TYP
0.154 (3.90)
0.120 (3.05)
0.016 (0.40)
0.008 (0.20)
0° to 15°
PIN 1
ID.
SEATING PLANE
0.070 (1.78)
0.060 (1.52)
0.030 (0.76)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
