Operating Procedures
:
Patterning
C O N F I D E N T I A L – FEI Limited Rights Data
5-54
Note
PMMA – PolyMethylMetaAcrylat
Application Files Examples
The
non-gas
assisted milling – the
Si New
application file:
•
Beam Type: Ion
•
Dwell Time (the time the beam spends on a single pixel per pass): 1.0 e
-6
s
•
Overlap (the beam diameter overlap): 50%
•
Volume per Dose (the amount of material volume removed per charge): 0.27 e
-9
m
3
/nC
This is called sputter rate in previous dual beam tools.
The
gas-assisted
application file – the
Tungsten
application file:
•
Beam Type: Ion
•
Dwell Time: 250 e
-9
s
•
Overlap: -50%
•
Volume per Dose: 0.025 e
-9
m
3
/nC
•
Refresh Time (the waiting time after each pattern pass): 0
•
Blur (beam defocus – to increase deposition for large areas): 0
If the overlap is positive the mill time can be calculated based on the volume per dose parameter and the beam
current:
For example, create a filled box pattern (5 × 5 × 2)
µm
(X × Y × Z, the desired material volume to be milled is
50
µm
3
) and choose 0.5 nA, which is 0.5 nC/s.
Therefore:
Doubling the Z size – the desired volume would be twice larger and the milling time twice longer, doubling the
beam current cuts milling time by half.
Table 5-7
Material Sputter Rates at 30 kV
Material
Volume per Dose
[
µm
3
/ nC]
Material
Volume per Dose
[
µm
3
/ nC]
C
0.18
Au
1.50
Si
0.27
MgO
0.15
Al
0.30
SiO
2
0.24
Ti
0.37
Al
2
O
3
0.08
Cr
0.10
TiO
0.15
Fe
0.29
Si
3
N
4
0.20
Ni
0.14
TiN
0.15
Cu
0.25
Fe
2
O
3
0.25
Mo
0.12
GaAs
0.61
Ta
0.32
Pt
0.23
W
0.12
PMMA
0.40
Summary of Contents for Scios 2
Page 1: ...User Operation Manual Edition 1 Mar 2017 ...
Page 103: ...Alignments I Column Alignments C O N F I D E N T I A L FEI Limited Rights Data 4 19 ...
Page 110: ...Alignments 254 GIS Alignment option C O N F I D E N T I A L FEI Limited Rights Data 4 26 ...
Page 170: ...Operating Procedures Patterning C O N F I D E N T I A L FEI Limited Rights Data 5 60 ...
Page 178: ...Maintenance Refilling Water Bottle C O N F I D E N T I A L FEI Limited Rights Data 6 8 ...
