Operating Procedures:
Patterning
C O N F I D E N T I A L – FEI Limited Rights Data
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First stage
Mill a
Regular Cross Section
with five superimposed box patterns sharing common edges.
1.
Select the display 1, the electron beam and start the beam.
2.
Perform the eucentric position setting procedure.
3.
Move the stage to where you want to mill the cross section.
4.
Tilt the stage to 52°.
5.
Store this position in the
Stage
module /
Location
list.
6.
Move the stage to an adjacent position for optimization of the ion beam imaging.
7.
Perform the Beams coincidence setting procedure.
8.
Select the display 2 and set the ion beam current to 150 pA – 5 nA, depending on the size of the cross section.
9.
Optimize the ion beam imaging.
10.
Move the stage to the stored position (see the step No. 5).
11.
Set magnification and the sample position.
12.
Acquire a ion beam
Snapshot
image.
13.
Select the
Patterning Control
module /
Pattern type
selector /
Regular Cross Section
.
Draw a rectangular box about 2
µm
from the area of interest.
14.
Set the
Property
tab module /
Application
item /
Si New
and the
Property
tab module /
Z size
value as needed.
15.
Acquire a ion beam
Snapshot
image.
16.
Click on the toolbar
Start patterning
icon.
17.
Acquire an electron or ion beam
Snapshot
image as desired to monitor the process.
Secon stage (optional)
1.
Perform the Beams coincidence setting procedure.
2.
Set the ion beam current to approximately ¼ of the beam current used for the first stage.
3.
Acquire a ion beam
Snapshot
image.
4.
Select the
Patterning Control
module /
Pattern type
selector /
Cleaning Cross Section
and draw a rectangular box.
Adjust its size so that its leading face is approximately 0.2
µm
from the target area and the trailing edge extends
just beyond the rough cut.
Note
Remember to set the Property tab module / Z size value
5.
Acquire another ion beam
Snapshot
to check positioning of the pattern to the feature.
6.
Click on the toolbar
Start Patterning
icon.
7.
Acquire an electron
Snapshot
image in a different display.
Third stage
1.
Acquire a ion beam
Snapshot
image in the display where milling takes place. Focus as needed.
2.
If the cut is too rough, change the ion beam current to 100 pA – 1 nA.
3.
Select the
Patterning Control
module /
Pattern type
selector /
Cleaning Cross Section
item and draw a rectangular
box. Adjust its size so that its leading face crosses the target area and the trailing edge extends just beyond the
rough cut.
Note
Remember to set the Property tab module / Z size value
4.
Acquire a ion beam
Snapshot
image.
5.
Click on the toolbar
Start Patterning
icon.
6.
Acquire an electron
Snapshot
image in a different display. A BSE detector (T1) is suitable for electron imaging
during ion patterning.
Summary of Contents for Scios 2
Page 1: ...User Operation Manual Edition 1 Mar 2017 ...
Page 103: ...Alignments I Column Alignments C O N F I D E N T I A L FEI Limited Rights Data 4 19 ...
Page 110: ...Alignments 254 GIS Alignment option C O N F I D E N T I A L FEI Limited Rights Data 4 26 ...
Page 170: ...Operating Procedures Patterning C O N F I D E N T I A L FEI Limited Rights Data 5 60 ...
Page 178: ...Maintenance Refilling Water Bottle C O N F I D E N T I A L FEI Limited Rights Data 6 8 ...
