7. Thermal Design
FM101-NA-20 module is designed to be workable on an extended temperature range, to
make sure the module can work properly for a long time and achieve a better
performance under extreme temperatures or extreme working conditions, such as high
temperatures and high speed data transfer, it is required to add a exposed copper area
at the corresponding motherboard position on the back of the FM101-NA-20 module,
and use a thermal conductive material to connect the module and the motherboard in
this area to ensure that the heat of the module can be released through the
motherboard. The following fogure shows the design.
Other measures to improve heat dissipation performance are as follows:
•
Heat devices and other heat sources on the motherboard are as far away from the
module as possible.
•
The ground plane of the motherboard under the module is as complete as possible,
and as many ground holes are drilled as possible to increase heat dissipation
capability.
•
Use screws to secure the module and motherboard to ensure good contact
between the motherboard and the module.
•
The use of heat sinks above the module is preferred, followed by the motherboard
below the module.
For details about thermal design, see
Fibocom_FM101-NA_Design Guide_Thermal
.
7. Thermal Design
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