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FIBOCOM L610-LA Series Hardware Guide
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heat sink pad is reserved for PCB packaging and welded.
3.1.2 Pin Definition
The pins are defined as follows:
Pin
Pin Name
I/O Level
Reset
Value
Description
1
WAKEUP_IN
I
V
IL
min=-0.3V
V
IL
max=0.63V
V
IH
min=1.2/2.2V
V
IH
max=2.0/2.8V
*
L
External device wake-up module
Left floating when not in use
2
AP_READY
I
V
IL
min=-0.3V
V
IL
max=0.63V
V
IH
min=1.2/2.2V
V
IH
max=2.0/2.8V
*
H
The module detects whether the host
is sleeping
Left floating when not in use
3
SLEEP_IND
O
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
L
SLEEP_IND
Left floating when not in use
4
W_DISABLE#
I
V
IL
min=-0.3V
V
IL
max=0.63V
V
IH
min=1.2/2.2V
V
IH
max=2.0/2.8V
*
L
Module flight mode control
Left floating when not in use
5
NET_MODE
O
V
OH
min=1.35V
V
OL
max=0.45V
L
Module state indication
Left floating when not in use
6
NET_STATUS
O
V
OH
min=1.35V
V
OL
max=0.45V
L
7
VDD_EXT
PO 1.8V
Module digital level, 1.8V output
Left floating when not in use
8
GND
G
-
Ground
9
GND
G
-
Ground
10
USIM_GND
G
-
Ground
11
DBG_RXD
I
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
DEBUG serial port Receive
Left floating when not in use
12
DBG_TXD
O
V
OL
max=0.45V
V
OH
min=1.35V
DEBUG serial port Transmit
Left floating when not in use
13
USIM_PRESENCE I
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
L
USIM hot plug detection; no need to
connect 10k to Ground in series;
