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FIBOCOM L610-LA Series Hardware Guide
Page 21 of
49
Pin
Pin Name
I/O Level
Reset
Value
Description
V
IH
max=2.0V
136
WLAN_EN
O
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
L
WLAN_EN
Left floating when not in use
137
UART3_RXD
I
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
UART3_RXD
Left floating when not in use
138
UART3_TXD
O
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
UART3_TXD
Left floating when not in use
139
BT_EN
O
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
L
BT_EN
Left floating when not in use
140
NC
-
NC
141
I2C2_SCL
I/O
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
L
I2C2_SCL
Left floating when not in use
142
I2C2_SDA
I/O
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
L
I2C2_SDA
Left floating when not in use
143
RFCTL_1
I/O
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
RFCTL_1
Left floating when not in use
144
RFCTL_2
I/O
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0VS
RFCTL_2
Left floating when not in use
Note:
Keep the unused pins floating, “*” indicates in development.
Pin 85-112 is the module thermal pad, and the corresponding ground pad is reserved for PCB
packaging and welded.
3.1.3 Pin Multiplexing
For L610 pin multiplexing, see
FIBOCOM L610-CN-00-00 GPIO Function Multiplexing
.
