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FIBOCOM MC610 Series Hardware Guide
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6.2 Structure Size
The structure size of MC610 series modules is shown in the following figure:
Figure 6-3 Structural dimension drawing (unit: mm)
6.3 SMT Paster
l
Please refer to
FIBOCOM MC610 Series SMT Design Guide
for module steel mesh design, solder
paste and furnace temperature control.
6.4 Packaging
MC610 module adopts tray sealed vacuum packaging mode, combined with the external packaging mode
of hard cartoon, which plays a maximum protective role in the storage, transportation and use of the
module.