FN-LINK TECHNOLOGY LIMITED
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3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125
℃
, 8 hours.
3.) After baking, put the right amount of desiccant to seal packages.
5. PACKING INFORMATION
5.1 Blister packaging
A piece of 100 PCS
5.2 Coiling Packaging
A roll of 2000pcs
