PCB Manufacturing Specifications
Tower KW2xDxxx Hardware Reference Manual, Rev. 0.2
4-2
Freescale Semiconductor
The following table defines some of the layers of the completed PCB. The artwork identification refers to
the name of the layer in commonly used terms.
NOTE
The TWR-KW2xDxxx contains high frequency 2.4 GHz RF circuitry. As a
result, RF component placement, line geometries and layout, and spacing to
the ground plane are critical parameters. As a result, BOARD STACKUP
GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing
must not be changed; follow the stackup (see
Figure 4-1
) information is
provided with the reference design.
Figure 4-1. TWR-KW2xDxxx PCB Stackup Cross-Section (Four Layer)
•
Solder mask is required
•
Silk screen is required
4.2
Panelization
The panel size can be negotiated depending on production volume.
4.3
Materials
The PCB composite materials must meet the following requirements:
Table 4-1. TWR-KW2xDxxx Layer by Layer Overview
Layer
Artwork Identification
File Name
1
Silkscreen Top
SILK_TOP.art
2
Top Layer Metal
TOP.art
3
Ground Layer
GND.art
4
Power Layer
PWR.art
5
Bottom Layer Metal
BOTTOM.art
6
Silkscreen Bottom
SILK_BOTTOM.art