Device User Guide — 9S12DT128DGV2/D V02.16
101
Freescale Semiconductor
calculations refer to Section A.1.8 Power Dissipation and Thermal
Characteristics.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
J
) in
°
C can be
obtained from:
Table A-4 Operating Conditions
Rating
Symbol
Min
Typ
Max
Unit
I/O, Regulator and Analog Supply Voltage
V
DD5
4.5
5
5.25
V
Digital Logic Supply Voltage
1
NOTES
:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
given operating range applies when this regulator is disabled and the device is powered from an external source.
V
DD
2.35
2.5
2.75
V
PLL Supply Voltage
1
V
DDPLL
2.25
2.5
2.75
V
Voltage Difference VDDX to VDDR and VDDA
∆
VDDX
-0.1
0
0.1
V
Voltage Difference VSSX to VSSR and VSSA
∆
VSSX
-0.1
0
0.1
V
Bus Frequency
f
bus
0.25
2
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper oper-
ation.
-
25
MHz
MC9S12DT128C
Operating Junction Temperature Range
T
J
-40
-
100
°
C
Operating Ambient Temperature Range
3
3. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela-
tion between ambient temperature T
A
and device junction temperature T
J
.
T
A
-40
27
85
°
C
MC9S12DT128V
Operating Junction Temperature Range
T
J
-40
-
120
°
C
Operating Ambient Temperature Range
3
T
A
-40
27
105
°
C
MC9S12DT128M
Operating Junction Temperature Range
T
J
-40
-
140
°
C
Operating Ambient Temperature Range
3
T
A
-40
27
125
°
C
T
J
T
A
P
D
Θ
JA
•
(
)
+
=
T
J
Junction Temperature, [
°
C
]
=
T
A
Ambient Temperature, [
°
C
]
=
Summary of Contents for MC9S12A128
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