Appendix A Electrical Characteristics
Freescale Semiconductor
MC9S12C-Family / MC9S12GC-Family
653
Rev 01.24
Table A-5. Thermal Package Characteristics
(1)
1. The values for thermal resistance are achieved by package simulations
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
T
Thermal Resistance LQFP48, single layer PCB
(2)
2. PC Board according to EIA/JEDEC Standard 51-2
θ
JA
—
—
69
o
C/W
2
T
Thermal Resistance LQFP48, double sided PCB
with 2 internal planes
(3)
3. PC Board according to EIA/JEDEC Standard 51-7
θ
JA
—
—
53
o
C/W
3
T
Junction to Board LQFP48
θ
JB
—
—
30
o
C/W
4
T
Junction to Case LQFP48
θ
JC
—
—
20
o
C/W
5
T
Junction to Package Top LQFP48
Ψ
JT
—
—
4
o
C/W
6
T
Thermal Resistance LQFP52, single sided PCB
θ
JA
—
—
65
o
C/W
7
T
Thermal Resistance LQFP52, double sided PCB
with 2 internal planes
θ
JA
—
—
49
o
C/W
8
T
Junction to Board LQFP52
θ
JB
—
—
31
o
C/W
9
T
Junction to Case LQFP52
θ
JC
—
—
17
o
C/W
10
T
Junction to Package Top LQFP52
Ψ
JT
—
—
3
o
C/W
11
T
Thermal Resistance QFP 80, single sided PCB
θ
JA
—
—
52
o
C/W
12
T
Thermal Resistance QFP 80, double sided PCB
with 2 internal planes
θ
JA
—
—
42
o
C/W
13
T
Junction to Board QFP80
θ
JB
—
—
28
o
C/W
14
T
Junction to Case QFP80
θ
JC
—
—
18
o
C/W
15
T
Junction to Package Top QFP80
Ψ
JT
—
—
4
o
C/W
Summary of Contents for MC9S12C Family
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