Appendix C Package Information
682
MC9S12C-Family / MC9S12GC-Family
Freescale Semiconductor
Rev 01.24
C.1.1
80-Pin QFP Package
Figure C-1. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2.
CONTROLLING DIMENSION: MILLIMETER.
3.
DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
4.
DATUMS -A-, -B- AND -D- TO BE
DETERMINED AT DATUM PLANE -H-.
5.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -C-.
6.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
7.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
SECTION B-B
61
60
DETAIL A
L
41
40
80
-A-
L
-D-
A
S
A-B
M
0.20
D
S
H
0.05 A-B
S
1
20
21
-B-
B
V
J
F
N
D
VIEW ROTATED 90
°
DETAIL A
B
B
P
-A-,-B-,-D-
E
H
G
M
M
DETAIL C
SEATING
PLANE
-C-
C
DATUM
PLANE
0.10
-H-
DATUM
PLANE
-H-
U
T
R
Q
K
W
X
DETAIL C
DIM
MIN
MAX
MILLIMETERS
A
13.90
14.10
B
13.90
14.10
C
2.15
2.45
D
0.22
0.38
E
2.00
2.40
F
0.22
0.33
G
0.65 BSC
H
---
0.25
J
0.13
0.23
K
0.65
0.95
L
12.35 REF
M
5
10
N
0.13
0.17
P
0.325 BSC
Q
0
7
R
0.13
0.30
S
16.95
17.45
T
0.13
---
U
0
---
V
16.95
17.45
W
0.35
0.45
X
1.6 REF
°
°
°
°
°
S
A-B
M
0.20
D
S
C
S
A-B
M
0.20
D
S
H
0.05
D
S
A-B
M
0.20
D
S
C
S
A-B
M
0.20
D
S
C
Summary of Contents for MC9S12C Family
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