Appendix C Package Information
Freescale Semiconductor
MC9S12C-Family / MC9S12GC-Family
683
Rev 01.24
C.1.2
52-Pin LQFP Package
Figure C-2. 52-Pin LQFP Mechanical Dimensions (Case no. 848D-03)
F
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER
DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
2.
DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-.
DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND
B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -H-
DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD
OR PROTRUSION 0.07 (0.003).
VIEW AA
AB
AB
VIEW Y
SECTION AB-AB
ROTATED 90
°
CLOCKWISE
DIM
A
MIN
MAX
MIN
MAX
INCHES
10.00 BSC
0.394 BSC
MILLIMETERS
A1
5.00 BSC
0.197 BSC
B
10.00 BSC
0.394 BSC
B1
5.00 BSC
0.197 BSC
C
---
1.70
---
0.067
C1
0.05
0.20
0.002
0.008
C2
1.30
1.50
0.051
0.059
D
0.20
0.40
0.008
0.016
E
0.45
0.030
F
0.22
0.35
0.009
0.014
G
0.65 BSC
0.75
0.018
0.026 BSC
J
0.07
0.20
0.003
0.008
K
0.50 REF
0.020 REF
R1
0.08
0.20
0.003
0.008
S
12.00 BSC
0.472 BSC
S1
6.00 BSC
0.236 BSC
U
0.09
0.16
0.004
0.006
V
12.00 BSC
0.472 BSC
V1
6.00 BSC
0.236 BSC
W
0.20 REF
0.008 REF
Z
1.00 REF
0.039 REF
CL
-X-
X=L, M, N
1
13
14
26
27
39
40
52
4X 13 TIPS
4X
N
0.20 (0.008) H L-M
N
0.20 (0.008) T L-M
SEATING
PLANE
C
0.10 (0.004) T
4X
θ
3
4X
θ
2
S
0.05 (0.002)
0.25 (0.010)
GAGE PLANE
C2
C1
W
K
E
Z
S
L-M
M
0.13 (0.005)
N
S
T
PLATING
BASE METAL
D
J
U
B
V
B1
A
S
V1
A1
S1
-L-
-N-
-M-
-H-
-T-
θ
1
θ
G
θ
1
θ
θ
3
θ
2
0
7
°
°
12
°
0
7
°
°
0
°
0
°
---
---
REF
12
°
REF
3X
VIEW Y
VIEW AA
2X R
R1
12
°
REF
12
°
REF
Summary of Contents for MC9S12C Family
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