66-MHz Electrical Characteristics
MPC561/MPC563 Reference Manual, Rev. 1.2
G-6
Freescale Semiconductor
should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is
placed over the thermocouple junction and over about one mm of wire extending from the junction. The
thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling
effects of the thermocouple wire.
G.4.1
Thermal References
The website for Semiconductor Equipment and Materials International is www.semi.org and their global
headquarters address is: 3081 Zanker Road, San Jose CA, 95134; 1-408-943-6900.
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents on
the WEB at www.global.ihs.com or 800-854-7179 or 303-397-7956.
JEDEC specifications are available on the WEB at www.jedec.org.
1. C.E. Triplett and B. Joiner, “
An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module
,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “
Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling
,” Proceedings of SemiTherm, San Diego, 1999, pp.
212-220.
G.5
ESD Protection
Table G-3. ESD Protection
Characteristics
Symbol
Value
Units
ESD for Human Body Model (HBM)
1
1
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated
Circuits.
2000
V
HBM Circuit Description
R1
1500
Ω
C
100
pF
ESD for Machine Model (MM)
200
V
MM Circuit Description
R1
0
Ω
C
200
pF
Number of pulses per pin
2
Positive pulses (MM)
Negative pulses (MM)
Positive pulses (HBM)
Negative pulses (HBM)
2
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification requirements. Complete DC parametric and functional testing shall be performed per applicable
device specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
—
—
—
—
3
3
1
1
—
Interval of Pulses
—
1
S
Summary of Contents for MPC561
Page 84: ...MPC561 MPC563 Reference Manual Rev 1 2 lxxxiv Freescale Semiconductor...
Page 144: ...Signal Descriptions MPC561 MPC563 Reference Manual Rev 1 2 2 46 Freescale Semiconductor...
Page 206: ...Central Processing Unit MPC561 MPC563 Reference Manual Rev 1 2 3 62 Freescale Semiconductor...
Page 302: ...Reset MPC561 MPC563 Reference Manual Rev 1 2 7 14 Freescale Semiconductor...
Page 854: ...Time Processor Unit 3 MPC561 MPC563 Reference Manual Rev 1 2 19 24 Freescale Semiconductor...
Page 968: ...Development Support MPC561 MPC563 Reference Manual Rev 1 2 23 54 Freescale Semiconductor...
Page 1144: ...Internal Memory Map MPC561 MPC563 Reference Manual Rev 1 2 B 34 Freescale Semiconductor...
Page 1212: ...TPU3 ROM Functions MPC561 MPC563 Reference Manual Rev 1 2 D 60 Freescale Semiconductor...
Page 1216: ...Memory Access Timing MPC561 MPC563 Reference Manual Rev 1 2 E 4 Freescale Semiconductor...