MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
106
Freescale Semiconductor
Ordering Information
pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should minimize
the disruption of signal quality or speed for output pins thus configured.
24.7
Pull-Up Resistor Requirements
The device requires high resistance pull-up resistors (10 k
Ω
is recommended) on open drain type pins
including I
2
C pins, Ethernet Management MDIO pin, and EPIC interrupt pins.
For more information on required pull-up resistors and the connections required for the JTAG interface,
see MPC8360E/MPC8358E PowerQUICC Design Checklist (AN3097).
25 Ordering Information
25.1
Part Numbers Fully Addressed by this Document
Table 80
provides the Freescale part numbering nomenclature for the MPC8360E/58E. Note that the
individual part numbers correspond to a maximum processor core frequency. For available frequencies,
contact your local Freescale sales office. In addition to the processor frequency, the part numbering scheme
also includes an application modifier, which may specify special application conditions. Each part number
also contains a revision code that refers to the die mask revision number.
Table 80. Part Numbering Nomenclature
1
1
Not all processor, platform, and QUICC Engine block frequency combinations are supported. For available frequency
combinations, contact your local Freescale sales office or authorized distributor.
MPC nnnn
e
t
pp
aa
a
a
A
Product
Code
Part
Identifier
Encryption
Acceleration
Temperature
Range
Package
2
2
See
Section 21, “Package and Pin Listings,”
for more information on available package types.
Processor
Frequency
3
3
Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification
support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core
frequencies.
Platform
Frequency
QUICC
Engine
Frequency
Die
Revision
MPC
8358
Blank = not
included
E = included
Blank = 0
°
C
T
A
to 105
°
C
T
J
C= –40
°
C T
A
to 105
°
C T
J
ZU = TBGA
VV = TBGA
(no lead)
e300 core speed
AD = 266 MHz
AG = 400 MHz
D = 266 MHz
E = 300 MHz
G = 400 MHz
A = rev. 2.1
silicon
8360
e300 core speed
AG = 400 MHz
AJ = 533 MHz
AL = 667 MHz
D = 266 MHz
F = 333 MHz
G = 400 MHz
H = 500 MHz
A = rev. 2.1
silicon
MPC
(rev. 2.0
silicon
only)
8360
Blank = not
included
E = included
0
°
C T
A
to
70
°
C T
J
ZU = TBGA
VV = TBGA
(no lead)
e300 core speed
AH = 500 MHz
AL = 667 MHz
F = 333 MHz
G = 400 MHz
H = 500 MHz
—