MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Freescale Semiconductor
29
UCC Ethernet Controller: Three-Speed Ethernet, MII Management
8.2
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.
8.2.1
GMII Timing Specifications
This sections describe the GMII transmit and receive AC timing specifications.
8.2.1.1
GMII Transmit AC Timing Specifications
Table 27
provides the GMII transmit AC timing specifications.
Table 25. RGMII/RTBI, GMII, TBI, MII, and RMII DC Electrical Characteristics (when operating at 3.3 V)
Parameter
Symbol
Conditions
Min
Max
Unit
Notes
Supply voltage 3.3 V
LV
DD
—
2.97
3.63
V
1
Output high voltage
V
OH
I
OH
= –4.0 mA
LV
DD
= Min
2.40
LV
DD
+ 0.3
V
—
Output low voltage
V
OL
I
OL
= 4.0 mA
LV
DD
= Min
GND
0.50
V
—
Input high voltage
V
IH
—
—
2.0
LV
DD
+ 0.3
V
—
Input low voltage
V
IL
—
—
–0.3
0.90
V
—
Input current
I
IN
0 V
≤
V
IN
≤
LV
DD
—
±10
μ
A
—
Note:
1. GMII/MII pins that are not needed for RGMII, RMII, or RTBI operation are powered by the OV
DD
supply.
Table 26. RGMII/RTBI DC Electrical Characteristics (when operating at 2.5 V)
Parameters
Symbol
Conditions
Min
Max
Unit
Supply voltage 2.5 V
LV
DD
—
2.37
2.63
V
Output high voltage
V
OH
I
OH
= –1.0 mA
LV
DD
= Min
2.00
LV
DD
+ 0.3
V
Output low voltage
V
OL
I
OL
= 1.0 mA
LV
DD
= Min
GND
– 0.3
0.40
V
Input high voltage
V
IH
—
LV
DD
= Min
1.7
LV
DD
+ 0.3
V
Input low voltage
V
IL
—
LV
DD
= Min
–0.3
0.70
V
Input current
I
IN
0 V
≤
V
IN
≤
LV
DD
—
±10
μ
A
Table 27. GMII Transmit AC Timing Specifications
At recommended operating conditions with LV
DD
/OV
DD
of 3.3 V ± 10%.
Parameter/Condition
Symbol
1
Min
Typ
Max
Unit
Notes
GTX_CLK clock period
t
GTX
—
8.0
—
ns
—
GTX_CLK duty cycle
t
GTXH/tGTX
40
—
60
%
—
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
t
GTKHDX
t
GTKHDV
0.5
—
—
—
5.0
ns
3
GTX_CLK clock rise time, (20% to 80%)
t
GTXR
—
—
1.0
ns
—