MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Freescale Semiconductor
69
Package and Pin Listings
21.2
Mechanical Dimensions of the TBGA Package
Figure 53
depicts the mechanical dimensions and
bottom surface nomenclature of the device, 740-TBGA
package.
Figure 53. Mechanical Dimensions and Bottom Surface Nomenclature of the TBGA Package