PIPS II O
Owners Man
Fi
Th
va
m
ion
To
(R
op
1.
th
µm
2.
20
ab
ce
3.
8 µ
4.
ab
m
NO
co
Pl
an
nual and Use
gure 4-7 Spe
he PIPS II do
ariety of sp
ounted direc
n polishing.
o obtain best
Refer to the
perating instr
After disc
he 15 mm p
m diamond
Dimple po
0-25 g load
bout 10 µm
ertain cerami
Dimple po
µm) using 0
Dimple po
bout 5 µm)
medium spee
OTE:
Us
ontamination
lease note th
nd silicon-ba
ers Guide
ecimen disc g
oes not use a
pecimen sha
ctly on a mo
t results wit
Gatan Mod
ructions.)
c grinding t
hosphor br
paste, 15-20
olish with fe
and low to
when mea
ics and semi
olish with a
0-2 µm diam
olish with a
) using 0.05
d.
se different
n.
hat the loads
ased materia
geometry.
any specime
apes. Rectan
odified spec
h dimple gri
del 656 Dim
to 40-70 µm
ronze wheel
0 g load and
elt wheel for
medium sp
surable, and
conductors.)
new felt wh
mond paste,
a new felt w
5 µm Alum
felt wheels
s and speeds
als. For mat
en clamps an
ngular TEM
imen post a
inding, follo
mple Grinde
m, coarse dim
l to a thickn
d low to med
r 3-5 min us
peed.
(This i
d is possibl
)
heel for 5-6
20-25 gm lo
wheel for 8-1
mina suspen
for differen
s suggested
terials that a
nd hence it w
M tensile sp
and dimpled
ow the steps
er User's Gu
mple grind
ness of 20-2
dium speed
sing 2-4 µm
s equivalent
le with tran
min (or to
oad and me
10 min (or t
nsion, 20-3
nt abrasives
above work
are more bri
will accept a
pecimens ca
in place pri
described b
uide for det
the sample
25 µm using
d.
m diamond p
t to a thickne
nsmitted ligh
a thickness
edium speed
to a thickne
30 gm load
s to avoid c
k best for si
ittle, lower
84
large
an be
ior to
below
tailed
with
g 2-4
paste,
ess of
ht for
of 6-
d.
ess of
d and
cross-
ilicon
loads
