Appendix C
SAFE HANDLING OF CMOS INTEGRATED CIRCUIT DEVICES
Many of the integrated circuit devices used in
communications equipment are of the CMOS
(Complementary Metal Oxide
Semiconductor) type. Because of their high
open circuit impedance, CMOS ICs are
vulnerable to damage from static charges.
Care must be taken in handling, shipping, and
servicing them and the assemblies in which
they are used.
Even though protection devices are provided
in CMOS IC inputs, the protection is effective
only against overvoltage in the hundreds of
volts range such as are encountered in an
operating system. In a system, circuit
elements distribute static charges and load the
CMOS circuits, decreasing the chance of
damage. However, CMOS circuits can be
damaged by improper handling of the
modules even in a system.
To avoid damage to circuits, observe the
following handling, shipping, and servicing
precautions.
1. Prior to and while servicing a circuit
module, particularly after moving within
the service area, momentarily touch both
hands to a bare metal earth grounded
surface. This will discharge any static
charge which may have accumulated on
the person doing the servicing.
NOTE
Wearing Conductive Wrist Strap will
minimize static buildup during servicing.
WARNING
When wearing Conductive Wrist Strap, be
careful near sources of high voltage. The
good ground provided by the wrist strap
will also increase the danger of lethal
shock from accidentally touching high
voltage sources.
2. Whenever possible, avoid touching any
electrically conductive parts of the
circuit module with your hands.
3. Normally, circuit modules can be
inserted or removed with power applied
to the unit. However, check the
INSTALLATION and MAINTE-
NANCE sections of the manual as well
as the module schematic diagram to
insure there are no objections to this
practice.
4. When servicing a circuit module, avoid
carpeted areas, dry environments, and
certain types of clothing (silk, nylon,
etc.) because they contribute to static
buildup.
5. All electrically powered test equipment
should be grounded. Apply the ground
lead from the test equipment to the
circuit module before connecting the test
probe. Similarly, disconnect the test
probe prior to removing the ground lead.
6. If a circuit module is removed from the
system, it is desirable to lay it on a
conductive surface (such as a sheet of
aluminum foil) which is connected to
ground through 100k of resistance.
C-1
Summary of Contents for R2600 Series
Page 8: ...3 7 1 3 AC DC Voltmeter 41 3 7 1 4 INT DIST EXT DIST Meter 43 v...
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Page 66: ...DISPLAY ZONE RF ZONE AUDIO ZONE Figure 3 1 Screen Zone Arrangement 20...
Page 68: ...Figure 3 2 System Help 22...
Page 83: ...Figure 3 11 General Sequence Mode Select 37...
Page 85: ...39 Figure 3 12 RF Display Zone...
Page 88: ...Figure 3 14 Digital Voltmeter Screens 42...
Page 102: ...Figure 3 22 Bar Graphs 56...
Page 107: ...Figure 3 24 Memory Screens 61...
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Page 205: ...Figure 11 1 R 2670 with SECURENET Option Housing 159...
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Page 218: ...Figure 13 8 Test Key Programming Display Figure 13 9 External Key Programming Display 172...
Page 225: ...Figure 13 12 Duplex Mode Display Zone 179...
Page 234: ...VOICE Figure 13 17 CLEAR SCOPE Markers 188...
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Page 249: ...Figure 14 8 SECURENET CLEAR SCOPE Display of Output Modulation 203...
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Page 267: ...Figure 17 7 Encryption Select Display Figure 17 7 Encryption Select Display 221 221...
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Page 291: ...Figure 18 1 Radio BER Test Mode Audio Zone Figure 18 2 Radio BER Test Mode BER Meter 245...
Page 293: ...Figure 18 4 Receive BER 247...
Page 298: ...Figure 18 6 ASTRO CLEAR SCOPE Display of Output Modulation 252...
Page 304: ...Figure 21 1 PROJ 25 Version Screen Figure 21 2 PROJ 25 Options Screen 258...
Page 309: ...Figure 21 6 SET UP Display Screen Figure 21 7 Encryption Select Display 263...
Page 335: ...Figure 22 4 PROJ 25 CONV CLEAR SCOPE Display of Output Modulation 289...
Page 339: ...Figure 24 1 PROJ 25 Version Screen Figure 24 2 PROJ 25 Options Screen 293...
Page 354: ...Figure 25 3 Encryption Select Display Figure 25 4 Algorithm Select Display 308...
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