Reference Design
2.
The figure below is a reference design for power and GND routing (taking PCB in QFN40 package as an example).
The GND vias circled in yellow are used for return paths of power and RF signals, and shall be connected to the
heat dissipation pad with short, wide traces through copper pour areas on the bottom layer (indicated by the
green arrows in
GND via for DC-DC
switching regulator
for power output
GND via for power
input from VBATL
GND via for power
input from VBAT_RF
GND vias for RF signals
Capacitor GND via for
power input from
VDD_VCO/RF
Capacitor GND via for
power input from
VDD_AMS
Figure 4-12 Power and GND routing reference design for 2-layer PCB (QFN40)
4.2.3 External Flash Connection for GR5515I0ND
The GR5515I0ND uses external QSPI Flash with clock frequency up to 64 MHz. To avoid crosstalk from other signals,
the Flash shall be as close to the IC as possible to minimize the QSPI route. QSPI route lengths should be matched,
with the tolerance within 50 mil.
is a reference design for the PCB layout of GR5515I0ND.
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