All Rights reserved, No Spreading without GOSUNCN Permission
51
Hardware Development Guide
ME3616
Requirements on the thickness of solder paste: control the thickness between 0.18mm and 0.20mm.
See the LCC module PAD’s steel mesh opening in the following table:
Table 7-2 LCC module PAD’s steel mesh opening
Module PAD GAP (G)=Center Distance (e)
-
PAD width (X)
Steel mesh opening
G≥0.5mm
Drill holes at 100% scale in
the direction of width;
extend 0.3mm outward in
the direction of length
G
<
0.5mm
Contract 0.05~0.1mm in the
direction of width;
Contract 0.05~0.1mm inward
in the direction of length,
extend 0.5mm outward in
the direction of length.
Figure 7–1 Module Board’s Steel Mesh Diagram
7.3.3.
M
ODULE
B
OARD
’
S
SMT
PROCESS
1
)
SMT Tape Reel:
The tape reels, which are suitable for SMT, have been made for most GOSUNCN modules. If the module has provided the tape
reel itself and meets the SMT requirements, customers can directly use it for module SMT.
0.1mm
0.1mm
0.5mm
0.1mm
Steel
mesh
opening
Module PAD on PCB