COMPONENT MAINTENANCE MANUAL
IN 1502H RADAR INDICATOR
TM109102
3-1
May/01
SECTION III FAULT DIAGNOSIS
1. General
This section provides troubleshooting information, for use when a unit fails to meet the
performance requirements of the functional test procedure in Part 3, Section II of the
RDR-1500B System Manual (IB21500B), Volume One TM109302 (006-15589-0000).
CAUTION:
THIS EQUIPMENT CONTAINS ELECTROSTATIC DISCHARGE SENSITIVE
(ESDS) DEVICES. ALL ESDS DEVICES MUST BE HANDLED IN
ACCORDANCE WITH PROCEDURES OUTLINED IN THE REPAIR SECTION
OF THIS MANUAL.
ESDS DEVICES INCLUDE, BUT ARE NOT LIMITED TO, CMOS, JMOS,
PMOS, NMOS, SOCMOS, HMOS, MOSFET MICROWAVE MIXER DIODES,
SOME BIPOLAR DEVICES AND SOME METAL FILM RESISTORS.
MOST DAMAGE TO ESDS DEVICES RESULTS IN DEGRADED
PERFOMANCE OR PREMATURE FAILURE, NOT IN CATASTROPHIC
FAILURE AT THE TIME EXPERIENCED.
2. Test Equipment
In general, entry into the Fault Diagnosis section starts from the functional test. Test
equipment should, therefore, be properly checked out, set up, and turned on prior to entry
into the Fault Diagnosis section. If it is desired to recheck the test equipment or test set up,
refer to Part 3, Section II, paragraph 2 of the RDR-1500B System Manual (IB21500B),
Volume One TM109302 (006-15589-0000) for procedures.
3. Troubleshooting
Troubleshooting procedures are performed using the system test panel (1) and a known good
IU-1507A Interface Unit and CN-1506A Control Unit. The correct troubleshooting procedure
is determined by the type of failure found in the functional test procedure. After the faulty area
is isolated by use of the troubleshooting procedure and repair is made, the unit should be
retested using the functional test procedure in Part 3 of the RDR-1500B System Manual
(IB21500B), Volume One.
4. Retest Procedure
After a fault is isolated and repaired, perform the functional test in Part 3, Section II of the
RDR-1500B System Manual (IB21500B), Volume One TM109302 (006-15589-0000), to
ensure that the repaired area is operating correctly and that other areas were not damaged
during the repair procedure.
5. Service Information
A. Proper Test Equipment Usage
Semiconductor devices and integrated circuits are frequently damaged by accidentally
applying excessive voltage or current to the device elements. These causes for failure are
reduced with proper test equipment.
The document reference is online, please check the correspondence between the online documentation and the printed version.
