2
Temperature/humidity
Maintain appropriate temperature and humidity in the equipment room.
•
Lasting high relative humidity can cause poor insulation, electricity leakage, mechanical
property change of materials, and metal corrosion.
•
Lasting low relative humidity can cause washer contraction and ESD and cause problems
including loose mounting screws and circuit failure.
•
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the switch.
For the temperature and humidity requirements for the switch, see
S6826 & S9826 Switch Series
Hardware Information and Specifications.
Cleanliness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points. In the worst case, this might shorten the device's lifetime and
even cause communication failure.
describes the dust concentration limits in the equipment
room.
Table1-1 Dust concentration limit in the equipment room
Substance
Particle diameter
Concentration limit
Dust particles
≥ 0.5 µm
≤ 3.5 × 10
6
particles/m
3
Dust particles
≥ 5 µm
≤ 3 × 10
4
particles/m
3
Dust (suspension)
≤ 75 µm
≤ 0.2 mg/m
3
Dust (sedimentation)
75 µm to 150 µm
≤ 1.5 mg/(m
2
h)
Corrosive gases can accelerate corrosion and aging of metal components. Make sure the corrosive
gases in the equipment room do not exceed the concentration limits as shown in
Table1-2 Harmful gas limits in the equipment room
Gas
Average concentration
(mg/m
3
)
Maximum concentration
(mg/m
3
)
SO
2
0.3
1.0
H
2
S
0.1
0.5
Cl
2
0.1
0.3
HCI
0.1
0.5
HF
0.01
0.03
NH
3
1.0
3.0
O
3
0.05
0.1
NO
X
0.5
1.0
EMI
All electromagnetic interference (EMI) sources, from outside or inside of the switch and application
system, adversely affect the switch in the following ways:
