Installation Manual
H3C SecPath V1000-A Security Gateway
Chapter 2 Preparation for Installation
2-2
Table 2-2
Limit to the content of dust in an equipment room
Substance
Unit
Content
Dust Particles/m³
≤
3 X 104
(No visible dust on the
table top for three days)
Note: diameter of a dust particle
≥
5
μ
m
Besides the dust, there are rigorous limits on the harmful gases that can accelerate the
erosion and aging of metals, such as salts, acids, and sulfides, as shown in the
following table.
Table 2-3
Limits on the contents of harmful gases in the equipment room
Gas
Maximum (mg/m
3
)
SO2 0.2
H2S 0.006
NH3 0.05
Cl2 0.01
2.1.3 ESD Prevention
Although the security gateway is designed to be electrostatic discharge (ESD)
preventive, the card circuits and even the device can be badly damaged when
excessive static electricity is present.
On the communication network connected to your device, the static electricity mainly
comes from the outside electrical fields, such as outdoor high-voltage power cables
and lightning, and from the indoor environments, floor materials and the internal system
such as the equipment frame. To prevent damage, observe the following:
z
Connect your device and the floor to the earth ground properly.
z
Keep the equipment room as clean as possible.
z
Maintain adequate temperature and humidity.
z
Wear an ESD-preventive wrist strap and clothes when handling the circuit board.
z
Place the removed circuit board upward on the ESD-preventive workbench, or into
a static shielding bag.
z
Hold the circuit board by its edge when observing or moving it, avoiding direct
contact with the elements on it.
