18
Note: When in REMOVE/TCH mode, the step times in the recipe are updated automatically upon the
completion of the TCH cycle.
Operation for Component Installation (Soldering):
1.
Load the desired Recipe using the MENU buttons (Fig. 3 and Section 7.0)
2.
Select INSTALL/RUN or INSTALL/TCH mode using the MENU buttons. If INSTALL/TCH is
selected, place the tip of the TCH T/C in contact with the component solder joint. (Fig. 3, 6, and
Section 7.0)
3.
Insert the proper nozzle into the heater head (Fig. 16)
4.
Insert the component into the nest with the standard nest plate or optional CPF. Solder paste or
flux paste may be pre-applied to some components when using a CPF. Orient the component to
meet any polarity requirements for the PCB assembly. (Fig. 19, Section 3.0)
5.
With the head in the rough UP position, slide the nest under the heater nozzle (Fig. 19, 13-15)
6.
Press <Start>. The vacuum turns on.
7.
Adjust the head down to pick up the component, and then raise the head away from the nest (Fig.
15)
8.
Align the leads on the component to the pads on the board using the video alignment optics.
(Fig. 17, 18)
9.
Lower the head to the rough DOWN position and then adjust the nozzle height to place the
component on the board. The component should touch, but not push on the board. Press the
VAC button or footswitch. The heaters will turn on and the cycle will continue with the PH step
after a short delay which allows the vacuum to dissipate. Immediately adjust the nozzle Z height
to approximately 1/8 inch above the component. The nozzle should NOT be touching the
component. (Fig. 13-15)
10.
The system will progress through Preheat (PH), Soak (SK) and Reflow (RF) steps at the
programmed top and bottom heater settings. When in INSTALL/RUN mode, the system will run
at the programmed heater settings for the step times programmed in the recipe. (This is a time-
driven cycle.) When in INSTALL/TCH mode, the system will heat at the programmed step
heater settings until the TGT temperature is reached by the TCH T/C. (This is a temperature
driven cycle, and is dependent on T/C feedback. Make sure the T/C is securely in contact with
the solder joint to ensure accurate temperature readings.) An L.E.D. bar graph progressively
illuminates from bottom to top, indicating progress through the cycle (Fig. 3 and Section 7.0)
11.
Cooling (CL) is the last timed step. When this is complete, adjust the head away from the
component, and then raise the head to the rough UP position.
12.
The board may be removed when it has sufficiently cooled.
Note: When in INSTALL/TCH mode, the step times in the recipe are updated automatically upon the
completion of the TCH cycle. (See Section 7.0 for detailed information on the recipe.)
