Chapter 5 Instruction Specifications
5-86
Item number
Application instructions-14
Name
Block exchange (EXCHANGE)
Ladder format
Condition code
Processing time (
µ
s)
Remark
R7F4
R7F3
R7F2
R7F1
R7F0
Average Maximum
XCG (d1, d2, n)
DER
ERR
SD
V
C
↕
z
z
z
z
Instruction format
Number of steps
Condition
Steps
As per the table
below.
XCG (d1, d2, n)
4
Bit
Word
Double word
Usable I/O
X
Y
R,
M
TD, SS,
CU, CT
WX WY
WR,
WM TC DX DY
DR,
DM
C
o
nstant
Other
d1
Exchange destination
head I/O
{
{
d2 Exchange source head I/O
{
{
n
Number of bits (words)
to be exchanged
{
{
{
{
{
The constant is set in
decimal.
Function
•
Exchanges the contents of the n bits from d1 to d1 + n - 1 and the contents between d2 and d2 + n - 1.
•
Bits are exchanged with bits and words are exchanged with words.
d1+n-1
d2+n-1
d1
d2
n bits (words)
If n is a word:
The contents (0 to 255) of the lower 8 bits (b7 to b0) of n (WX, WY, WR, WM, TC) are set to the
number of bits (words) to be exchanged.
If n is a constant:
0 to 255 (decimal) can be designated for the number of bits (words) to be exchanged.
Notes
•
Use this instruction so that d1 + n
−
1 and d2 + n - 1 do not exceed the I/O range (R7BF, M3FFF, WRFFF, and WM3FF). If they
exceeds the I/O range, DER is equal to '1' and the exchange is performed up to the maximum range with respect to the smaller number of
bits (words) specified in d1 and d2.
•
If n is equal to “0,” the block exchange is not performed and DER (R7F4) will be set to “0.”
Program example
X00001 DIF1
XCG (WM000, WM100, 256)
LD
X00001
AND DIF1
[
XCG (WM000, WM100, 256)
]
Program description
•
When X00001 rises, the contents of WM000 to WM0FF are exchanged with the contents of WM100 to WM1FF.
X
C
G (d1,
d2,
n)
Processing time (
µ
s) (Average)
n
Bit
Word
1
139
120
16
338
159
32
528
207
64
918
284
128
1899
449
255
3695
779
Summary of Contents for HIDIC MICRO-EH
Page 1: ...HITACHI PROGRAMMABLE CONTROLLER APPLICATION MANUAL NJI 350B X ...
Page 12: ...MEMO ...
Page 14: ...Chapter 1 Features 1 2 MEMO ...
Page 50: ...Chapter 4 Product lineup and wiring 4 18 MEMO ...
Page 196: ...Chapter 5 Instruction Specifications 5 146 ...
Page 263: ...Chapter 11 Communication Specifications 11 10 MEMO ...
