Enhanced Micro TDC 3000 User’s Manual
1-9
9/95
1.3
1.3 CIRCUIT CARD HANDLING
The circuit cards or Printed Wire Boards (PWBs) are adequately protected from damage
caused by Electrostatic Discharge (ESD) only while installed in the system module, or
packed inside the conductive plastic bag in which they are shipped. To avoid ESD damage
when the card is handled outside its enclosure, to guard against electrical overstress, and to
maintain personnel safety, the following practices and procedures must be followed:
•
Turn off power to the module before removing or inserting the card.
•
Handle the card only by its edges. Do not touch the printed wire board runs,
connectors, or components unless you are wearing a grounded wrist-strap and the
card is on a conductive work-surface.
•
When applying power to the system before installation is complete, terminate all
loose wires within the cabinet or console. Make sure power is off when doing any
wiring work.
•
ESD-generating materials, such as plastic, rubber, nylon, polyester, vinyl, silk, or
synthetic materials or garments, should not be allowed in the area of the cards. If
you are wearing clothing of such material, you must stand on a grounded floor-mat
while wearing a grounded shoe-strap, or you must wear a grounded wrist-strap
while handling cards. Note: take special care to always keep the cards away from
such material because static charges cannot be drained off, except by discharge.
•
Do not carry unprotected cards across carpeting, unless it is grounded conductive
carpet such as conventional fiber with woven-in ground wires. Always keep the
circuit card in its protective bag until it is actually needed.
•
All test equipment and tools must be connected to the metal chassis or module frame
with a ground wire, before touching the card or internal wiring.
•
Cards must be handled and transported to and from the job site in their protective
bags (see approved material list).
•
Personnel must wear an approved wrist-strap connected to the chassis before
removing the card from its protective bag or card slot.
•
When shipping a suspected defective card, pack it in its protective bag before
placing it in the shipping carton. Note that cards must be protected against further
damage so that failure analysis can be accomplished.
•
Do not use standard Bubble Pack mailers.
•
Do not allow unprotected cards to come in contact with Styrofoam packing material.
For additional ESD information, refer to the LCN Planning manual in the System Site
Planning - 1 binder.
Summary of Contents for Enhanced Micro TDC 3000
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