4.
Remove the heat sink from the computer (2).
5.
UMA models: Thoroughly clean the thermal material from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with
the heat sink and system board spare part kits. The following illustration shows the replacement
thermal material locations.
Thermal paste is used on the system board component (1) and on the heat sink area (2) that services it.
Component replacement procedures
47
Summary of Contents for 17-cn0 Series
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