b.
Remove the heat sink (2) from the system board.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink, processor, and system board spare part kits.
The following illustrations show the replacement thermal material locations.
●
Discrete graphics with fan: Thermal paste is used on the processor (1) and associated heat sink area
(2), as well as the graphics chip (3) and associated heat sink area (4).
Component replacement procedures
59
Summary of Contents for 17-x Series
Page 1: ...HP Notebook PC Intel Models HP 17 x000 17 x099 Maintenance and Service Guide ...
Page 4: ...iv Safety warning notice ...
Page 8: ...viii ...
Page 14: ...6 Chapter 1 Product description ...
Page 29: ...Display assembly subcomponents Display assembly subcomponents 21 ...
Page 34: ...26 Chapter 3 Illustrated parts catalog ...
Page 68: ...60 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts ...
Page 96: ...88 Chapter 8 Backing up restoring and recovering in Windows 10 ...
Page 102: ...94 Chapter 10 Specifications ...
Page 106: ...98 Chapter 11 Power cord set requirements ...
Page 108: ...100 Chapter 12 Recycling ...
Page 112: ...104 Index ...