EL-MF877-00 Page 2
Template Revision B
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
Socket Spanner
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on part 1,and then remove part 1;
2. Unscrew the screws on part 2,and then remove part 2 from PCB 10;
3. Unscrew the screws on part 3,and then remove part 3;
4. Remove the heatsink 4 from PCB 10;
5. Remove the heatsink 5 from PCB 10;
6. Unscrew the hexagonal posts 6 on PCB 7 and 8,and then remove hexagonal posts 6 and PCB 7 and 8;
7. Unscrew the hexagonal posts 9 ,and then remove hexagonal posts 9;
8. Unscrew the screws on PCB 10,and then remove PCB 10 from panel 13;
9. Remove shielding finger 11 from panel 13;
10. Remove film 12 from panel 13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.3 Material of the facility built
