EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Unscrew the screws on cover 2, and then remove cover 2.
3. Remove all of the inner cables.
4. Unscrew the screws on PCB 3, and then remove PCB 3.
5. Unscrew the screws on PCB 4, and then remove PCB 4.
6. Unscrew the screws on fan 5, and then remove fan 5 from base 12.
7. Unscrew the screws on PCB 6, and then remove PCB 6.
8. Unscrew the screws on PCB 7, and then remove PCB 7.
9. Unscrew the screws on power supply 8, and then remove power supply 8.
10. Remove power cable 9 from the chassis.
11. Remove AC cable holder 10 from the chassis.
12. Unscrew the screws on PCB 11, and then remove PCB 11 from the chassis.
13. Remove all of the labels from the chassis.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1 Remove mounting angle 1
