Environmental
speci
fi
cations
lists
the
HBA
environmental
speci
fi
cations.
Table
2
HBA
environmental
speci
fi
cations
Environment
Minimum
Maximum
Operating
temperature
0
°C/32
°F
55
°C/131
°F
Storage
temperature
-20
°C/-4
°F
70
°C/158
°F
Relative
humidity
(noncondensing)
10%
90%
Storage
humidity
(noncondensing)
5%
95%
Physical
speci
fi
cations
lists
the
HBA
speci
fi
cations.
Table
3
HBA
speci
fi
cations
Type
Speci
fi
cation
Bus
interface
64-bit,
PCI-X
2.0
266-MHz
DDR,
compatible
with
66/33-MHz
PCI
and
133/100/66-MHz
PCI-X
Conforms
to
PCI
Local
Bus
Speci
fi
cation,
revision
2.3
,
PCI
Bus
Power
Management
Interface
Speci
fi
cation,
revision
1.1
,
PCI
Hot
Plug
Speci
fi
cation,
revision
1.0
Fibre
Channel
speci
fi
cations
Bus
type:
fi
ber
optic
media
Bus
transfer
rate:
4Gb/s
FC
increases
aggregate
throughput
rate
to
800
MB/s
in
full-duplex
mode
Central
processing
unit
(CPU)
Single-chip
design
that
includes
a
RISC
processor,
Fibre
Channel
protocol
manager,
PCI-XDMA
controller,
integrated
serializer/deserializer
(SEREDES),
and
electrical
transceivers
that
can autonegotiate
a data rate of 4
Gb/s
Memory
1-MB
SRAM,
1-MB
fl
ash
(SPI),
and
2-KB
NVRAM
(SPI)
Signal
voltage
3.3
V
(mode
1),
3.3
V/1.5
V
(mode
2)
Data
rate
4,
2,
1
Gb/s
auto-negotiation
(4.2480/2.1240/1.0625
Gb/s)
Onboard
DMA
Five-channel
DMA
controller:
two
data
and
one
command,
one
auto-DMA
request,
and
one
auto-DMA
response.
Frame
Buffers
Integrated
10-KB
frame
buffer
FIFOs
(6-KB
receive
and
4-KB
transmit)
for
each
data
channel.
Ports
Single
or
dual
4
Gb/s
Connectors
Small-form-factor
fi
xed
(SFF)
multimode
optic
with
LC
connector
Form
factor
Low-pro
fi
le
MD2:
16.93
cm
×
5.15
cm
(6.7
in.
×
2.5
in.)
Bracket
size
Standard:
1.84
cm
×
12.08
cm
(0.73
in.
×
4.76
in.)
Low-pro
fi
le:
1.84
cm
×
8.01
cm
(0.73
in.
×
3.15
in.)
Power
consumption
~11.0
Watts
10
HBA
features
