HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
Page 2
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
0
2.0 Tools
Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if applicable)
Screwdriver
Type-cross #1
(JIS B 4633-1987)
Screwdriver Type-cross
#2
(JIS B 4633-1987)
3.0 Product
Disassembly
Process
3.1
List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1
Remove 6 cell battery.
2
Remove two M2.5*5L screws on HDD door, then take out HDD (contains PCA)
3
Remove one M2.5*7.5L screw on BASE cover, then take out ODD (contains PCA)
4
Remove three M2.5*5L screws on BASE cover, then take out RAM door and MINIPCI
door.
5
Remove fourteen M2.5*7.5L and nine M2*3L screws on BASE cover, then reverse it.
6
Remove keyboard cover assy., then take out keyboard and draw out LCD assy.
7
Reverse it and remove BASE case assy.
8
Remove two M2.5*4L screws, then remove daughter board PCA.
9
Remove four M2.5*4L screws on top cover assy., then remove AV board PCA.
10
Remove four M2.5*4L screws, then take out MB PCA.
11
Remove six M2.5*5L screws, then take out LCD bezel
12
Remove one M2*2.5L and six M2.5*5L screws, then take out inverter board and LCD
panel.
13
Disassemble LCD panel and remove mercury backlight for selective treatment
14
Remove three MS2*1.8L screws on top cover assy., then take out LED board.
15
Divide motherboard from connecter and take out RTC coin cell battery for selective
treatment
3.2
OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:
