3.
Remove the heat sink (2).
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink
section (2) that services it.
Reverse this procedure to install the heat sink.
Component replacement procedures
51
Summary of Contents for CTO 13t-ab000
Page 4: ...iv Safety warning notice ...
Page 7: ...11 Recycling 66 Index 67 vii ...
Page 8: ...viii ...
Page 23: ...Computer major components Computer major components 15 ...