2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 screw driver
Philip #0
Description #2 service fixture
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove bumper ring sub assy.
2. Remove Battery cable,EDP FPC & T/S FPC
3. Remove Powe Board assy, Audio Board Assy and Power FPC
4. Remove Battery Pack
5. Remove Remove Docking support bracket
6. Remove Speaker module
7. Remove WWAN module & GPS module
8. Remove WLAN module
9. Remove MB Assy
10. Remove WLAN Antenna & WWAN Main/Aux Antenna
11. divide Power Board assy (remove 1st Mic,8M camera ,Volume board)
12. divide MB assy (remove Docking FPC, 2nd Mic, 2M CAMERA)
13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step 1 Remove bumper ring sub assy Step2 Remove Battery cable, EDP FPC & TS FPC
EL-MF877-00 Page 2
Template Revision A
