NOTE:
Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with UMA graphics
subsystems.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly
(1)
and
(3)
, and the processor component
(2)
, each time the fan/heat sink assembly is removed. Thermal
pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is
reinstalled.
The following illustration shows the locations for thermal material on systems with discrete graphics
subsystems.
80
Chapter 4 Removal and replacement procedures
Summary of Contents for G62 Series
Page 4: ...iv Safety warning notice ...
Page 6: ...vi MSG revision history ...
Page 10: ...10 Recycling 114 Battery 114 Display 114 Index 121 x ...
Page 27: ...Computer major components Computer major components 17 ...
Page 34: ......
Page 121: ...Universal Serial Bus Pin Signal 1 5 VDC 2 Data 3 Data 4 Ground Universal Serial Bus 111 ...
Page 130: ...22 Remove the LCD panel 23 Recycle the LCD panel and backlight 120 Chapter 10 Recycling ...
Page 135: ......