EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at
Item Description
Notes
Quantity of
items
included in
product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing refractory
ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
Hexagon Screw Driver
Diagonal cutting nippers
Nosed pliers
Knife
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Remove ASSY RC by screw driver& hand.
2.
Remove SHD USB by hand.
3.
Remove fabric conductive, acetic tapes, LVDS FFC& USB cable.
4.
Remove Mylar& Unlock all screws in PCBA.
5.
Disassemble PCBA from ASSY SHD & remove all wires.
6.
Remove ASSY bezel by screw driver& hand.
7.
Remove CTRL BD by hand.
8.
Remove Brackets by screw driver& hand.
9.
Remove panel from glass by knife& hand.
10.
Remove privacy filter by hand.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
