NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board each time the heat sink is removed. Thermal paste is used on the processor
(1)
and the
heat sink section
(2)
that services it. Thermal pads are used on the Northbridge chip
(3)
, the video
memory chip
(4)
, and the system board capacitors
(5)
, and the sections of the heat sink
(6)
that service
these components. Replacement thermal material is included with all heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the replacement thermal material locations for computer models
equipped with an AMD processor.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board each time the heat sink is removed. Thermal paste is used on the processor
(1)
and the
heat sink section
(2)
that services it. Thermal pads are used on the Northbridge chip
(3)
, the video
memory chip
(4)
, and the system board capacitors
(5)
, and the sections of the heat sink
(6)
that service
these components. Replacement thermal material is included with all heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the replacement thermal material locations for computer models
equipped with an Intel processor.
104 Chapter 4 Removal and replacement procedures
Summary of Contents for Pavilion dv7-1100 - Entertainment Notebook PC
Page 1: ...HP Pavilion dv7 Entertainment PC Maintenance and Service Guide ...
Page 4: ...iv Safety warning notice ...
Page 26: ...Computer major components 18 Chapter 3 Illustrated parts catalog ...
Page 113: ...Reverse this procedure to install the heat sink Component replacement procedures 105 ...
Page 167: ...Universal Serial Bus Pin Signal 1 5 VDC 2 Data 3 Data 4 Ground Universal Serial Bus 159 ...
Page 181: ......