NOTE:
The following illustration shows the replacement thermal material locations on a
computer model equipped with an Intel processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and Northbridge chip and the heat sink section
(2)
that services them
●
A thermal pad is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
NOTE:
The following illustration shows the replacement thermal material locations on a
computer model equipped with an Intel processor and a graphics subsystem with UMA memory.
Thermal paste is used on the processor
(1)
and Northbridge chip and the heat sink section
(2)
that services them.
88
Chapter 4 Removal and replacement procedures
