EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Star screwdriver
OD 3.3mm
Cross screwdriver
OD 3.0mm
Cross screwdriver
OD 6.0mm
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove side panel
2. Remove front bezel
3. Unplug ODD & HDD cables
4. Remove drive cage
5. Remove FIO cage
6. Remove ODD & HDD
7. Remove all cables
8. Remove fan duct
9. Remove cooler
10. Remove CPU
11. Remove Memory
12. Remove WLAN module
13. Remove all PCIEXP cards
14. Remove card reader
15. Remove antenna cable
16. Remove MB and bettery
17. Remove PSU
18. Remove speaker
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
