MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx driver
T15
Phillips screwdriver
#2
Flathead screwdriver
Medium
Socket screwdriver
5 mm / 8 mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove top cover of systems by hood latch.
2. Remove Fan cage module, Air baffle and Riser cage from system.
3. Remove lithium battery from the system by medium flat head screw driver.
4. Remove Mega-cell HSTNS-BB05 from the system
5. Use Torx driver with T15 to unlock screws and remove bracket with PCA from LFF system \ remove HDD cage with
PCA from SFF system.
6. Remove the Power supply(s) from system.
7. Use Torx driver with T15 to unlock thumbscrew and remove the System board with tray from system.
8. Riser cage : Use Torx driver with T15 to unlock screws and Remove the riser card (PCA)
9. bracket with PCA : Use Torx driver with T15 to unlock screws and remove HDD BP (PCA) from bracket [LFF system]
HDD cage with PCA : Use Torx driver with T15 to unlock screws and remove HDD BP (PCA) from HDD cage [SFF
system]
10. System board with tray : Use Torx driver with T15, 5 mm socket screwdriver and 8 mm socket screwdriver to unlock
screws to remove System board (PCA) from tray.
11. Power supply(s) : Remove Capacitors > 2.5CM of the power supply(s) from the system. With #2 Philips screw driver
remove the screws securing the top cover and the heatsinks in the P/S then locate the capacitors and pry from the
PCB with a medium flat head screw driver and dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
