EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
radioactive substances
N/A
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Hexagonal Screwdriver (T15)
T15 2.55-
3.00kgf.cm
Philips Screwdriver
2# 2.55-
3.00kgf.cm
Knife
Side Cutter
Star key wrench
Slotted Screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassembly process – Removing Back Cover
2. Disassembly process – Installing Wireless Card
3. Disassembly process –Installing DIMM
4. Disassembly process – Do not remove the HDD cage
5. Disassembly process -Remove the HDD cage
6. Disassembly process (CPU Installing)
7. Disassembly process (Installing back cover bracket)
8. Disassembly process (Assemble MCR, webcam, BIO reader (If necessary)
9. Disassembly process (MSR,Webcam,BIO)
10. Disassembly process (Assemble back cover)
11. Compact Stand Assembling (Without Power Supply)
12.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1.Description of the sample submitted for assessment
