MF877-00 Page 2
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torque Driver (Standard)
T10
Torque Bit
T10-70 mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew and remove - SCREW-MACHINE ASSEMBLY M5 X 0.8 10M ROHS at 2 locations
2. Unscrew and remove - ASSY, BULKHEAD BLANK FP
3. Unscrew and remove - ASSY, BLANK STACKING LAVA
4. Press handle and remove - PS BLANK FILLER
5. Press handle and remove PWR SUPPLY 680 W
6. Unscrew and remove - SCREW-THD-RLG M3 X 0.5 5MM-LG BLACK ROHS at 17 Locations and ASSY, CHASSIS
COVER LAVA2 AQM
7. Unplug Connector of FAN ASSEMBLY LAVA at 3 locations from PCA and remove the FAN ASSEMBLY LAVA
8. Unplug and remove - 1MM FFC CABLE,76MM LONG
9. Unscrew and remove - SCREW T10 M3X6 at 2 locations.
10. Remove PCA, LAVA LED BOARD
11. Remove PUSHBUTTON, SMT, MODE SWITCH
12. Unscrew and remove SCREW-TAPPING M3 X 0.5 8MM-LG ROHS at 11 Locations and PCA, LAVA2 24SR WITH
POE+ & MECH
13. Remove INSULATOR LAVA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
