MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T-10
Torx Driver
T-15
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery
– Locate the battery on the system Board, use fingers to remove the battery and dispose of
properly.
2. Mega cell
– Pull the mega cell holder to get them out of the chassis and dispose of properly.
3.
– Remove the PSU from the system. Remove the screws securing the top cover, locate the
capacitors and use a medium flat head screwdriver to remove them and dispose of properly.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1# : HSTNS-PD60
Attachment 1- Remove Electrolytic Capacitors.
Attachment 2- Locate and remove Coin Cell.
Attachment 3- Locate and remove Megacell.
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