7
DF57 Series
●
Low Profile “Swing-Lock” Board to Wire Connector for Power
1. Recommended temperature
profi le
The temperature profi les are based on the above conditions.
In individual applications the actual temperature may vary,depending on solder paste type, volume/
thickness and board size/thickness. Consult your solder paste and equipment manufacturer for
specifi c recommendations.
2.Recommended manual soldering
Manual soldering : 350ç ± 10ç for 3 seconds
3. Recommended screen thickness and
open area ratio (Pattern area ratio)
Thickness : 0.1mm
Open area ratio : 100%
4.Board warpage
Maximum of 0.02mm at the connector center, with both ends of the connector as reference points.
5.Cleaning conditions
Cleaning is not recommended. When cleaning, please evaluate as if can deteriorate the
performance including mechanical operation and environmental resistance.
6.Precautions
■
When inserting crimp-type (solderless) terminals to crimping (solderless) sockets, to maintain
reliable performance, please do not insert obliquely.
■
DO NOT mate/un-mate non-terminated plugs with non-mounted receptacles.
This may lead to damage or deformation of the contacts.
■
Removal of the holding electric cable may cause damage so please be careful.
■
DO NOT apply fl ux to the contact terminals when hand soldering the receptacle to the board.
Wicking of the fl ux into the electrical contact areas may lead to connection failures.
■
Slight discoloration on the insulating materials will not affect form, fit or function of the
connectors.
■
Please refer to the documents "DF57 Series Cable assembly Procedure ETAD-H0421", "Crimp
condition" and "DF57-****SCF(A)(**) Crimp quality standards ATAD-H0404" for the cable
assembly procedures.
■
Please refer to the "DF57H Series Mating/Unmating Operation Instruction Manual (ETAD-H0652)"
for the connector operation.
B
Usage Recommendations
TIME (sec)
180ç
100
150
200
250
220ç
PRE-HEATING TIME
SOLDERING TIME
MAX 250ç
90 to 120sec
60secMAX
10secMAX
TEMPERATURE(ç)
0
Dec.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Downloaded from
Downloaded from
Downloaded from
Downloaded from
Downloaded from
Downloaded from
Downloaded from
