Chassis Structure
shows the chassis components of the VP9650.
Figure 3-2
VP9650 chassis components
1 Dust filter slot
2 Board slot
3 Power module slot
4 ESD hole
5 Fan assembly slot
6 Chassis handle
Heat Dissipation System
The VP9650 heat dissipation system incorporates the following:
l
Fan assembly: dissipates the heat of the board inside the chassis.
l
Fan supplied with the power module: dissipates the heat of the power module.
The VP9650 fan assembly is located on the right part of the chassis. The fan assembly
provides a fan monitoring board, which can generate alarms when faults occur in the fan.
NOTICE
For heat dissipation, do not leave any slots empty. If a slot has no board installed, install
a filler panel.
The fan supplied with the power module is at the bottom of the chassis. The air channel
of the power module is separated from the fan assembly. The air enters into the power
module from the front side and vents out from the rear side for heat dissipation.
HUAWEI VP9650
Product Description
3 Product Structure
Issue 06 (2018-08-10)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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